pSemi joins the Connectivity Standards Alliance to Shape the Future of IoT (Internet of Things)

Appointment to the Zigbee Working Group subcommittee positions pSemi for leadership in next-generation IoT standards, technology, and experiences

San Diego, CA – June 13, 2024 – pSemi® Corporation, a leader in the design and development of semiconductor integration and advanced connectivity, today announced that it, alongside its parent company Murata, has expanded its role to “Participant” level with The Connectivity Standards Alliance (CSA), an international community of more than 675 technology companies committed to open standards for the Internet of Things (IoT). In addition, Peter Bacon, director of systems engineering at pSemi, was recently appointed to the Zigbee Working Group, a subcommittee of CSA that is dedicated to defining standards for the wireless technology designed for low-power devices that need to communicate with each other over short distances.

CSA’s mission is to create standards, tools, and platforms that make all connected devices work together to enhance end users’ day-to-day experiences. Its members, which include LG, Samsung, NXP, and others, work collaboratively to develop IoT technology standards, offer certification programs, and promote the benefits of open, global standards for a wide range of connected technology solutions, including Matter, Aliro, Zigbee, and others.

pSemi’s increased role with CSA aligns with the company’s expanded IoT product offerings as it recently announced the PE562212—its smallest PA-LNA-SW IoT front-end module (FEM). PE562212 is an ultra-compact multi-protocol 2.4 GHz FEM that enables a variety of connectivity options for IoT devices and is designed in adherence to the IEEE 802.15.4 Zigbee requirements to support the CSA-led Matter protocols, an industry framework that focuses on simplifying connected experiences.

“Murata has been a proud member of CSA for more than a decade, and at pSemi, we are thrilled to expand our involvement to ‘Participant’ level this year, particularly as we expand our IoT offerings. Our increased participation underscores our commitment to the connectivity market and willingness to collaborate with the entire ecosystem to advance the industry. I look forward to working closely with my peers and colleagues to address some of the most pressing issues the connectivity industry is facing and to play a part in defining standards that will accelerate the adoption of IoT products.”
Peter Bacon
Director of systems engineering pSemi Corporation, a Murata Company
pSemi will also participate in the upcoming CSA Alliance Member Meeting in Washington, DC on June 25, 2024. For more information about pSemi and its industry-leading connectivity solutions please visit www.psemi.bonfirela.com. For more information about CSA, its mission, and current initiatives, please visit www.csa-iot.org.

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About Murata

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world. Product specifications are subject to change without notice. For more information, visit Murata’s website at murata.com.

About pSemi

pSemi (formerly Peregrine Semiconductor) is a leader in the design and development of semiconductor integration, providing world-class capabilities with high-performance RF, analog and mixed signal solutions. With a 30-year legacy of technology advancements, strong IP portfolio and deep expertise in RF integration, our solution portfolio spans power management, connected sensors, antenna tuning, and RF frontends, which enable advanced modules for smartphones, base stations, personal computers, electric vehicles, data centers, IoT devices, healthcare and more. A wholly-owned subsidiary of Murata Electronics North America, Inc., pSemi is headquartered in San Diego, with additional offices spanning North America, Europe, and Asia. For more information, please visit www.psemi.bonfirela.com and connect on LinkedIn at https://www.linkedin.com/company/psemi/.

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  • High Linearity RF Switches

    Industry-leading linearity and RF performance
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD and reliability
  • High Isolation RF Switches

    Industry-leading isolation and RF performance
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD and reliability
  • Low Insertion Loss RF Switches

    Industry-leading insertion loss and RF performance
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD and reliability
  • Antenna Tuning Switches

    Industry-leading RF power handling and ruggedness
    Best-in-class harmonic and linearity
    Small form factor with robust ESD and reliability
  • 75Ω Wired Broadband Switches

    Unmatched linearity performance for DOCSIS 3.1
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD ratings and reliability
  • Broadband RF Switches

    Wideband support with a frequency range from 0 Hz to 67 GHz
    Industry-leading insertion loss, isolation, linearity and settling time
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Best-in-class ESD and reliability
  • High Power Switches

    Industry-leading power handling and RF performance
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD and reliability
  • Automotive Switches

    AEC-Q100 Grade 2-certified supporting temperatures up to +105°C
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD and reliability
  • Extended Temperature RF Switches

    Wide temperature range support from -55°C to +125°C
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD and reliability
  • 75Ω Wired Broadband RF Digital Step Attenuators

    High linearity, fast switching time with wide bandwidth
    Best-in-class attenuation error with fine attenuation steps
    Monolithic CMOS solution that integrates RF, analog and digital
    Excellent ESD protection and reliability
  • Glitchless RF Digital Step Attenuators

    High linearity, fast switching time with wide bandwidth
    Best-in-class attenuation error with fine attenuation steps
    Monolithic CMOS solution that integrates RF, analog and digital
    Excellent ESD protection and reliability
  • General-purpose RF Digital Step Attenuators

    High linearity, fast switching time with wide bandwidth
    Best-in-class attenuation error with fine attenuation steps
    Monolithic CMOS solution that integrates RF, analog and digital
    Excellent ESD protection and reliability
  • 2.4 GHz IoT FEMs

    Industry-leading monolithic Wi-Fi RF front-end solutions
    High linearity performance for Wi-Fi 6 and W-Fi 6E
    Compact form factors integrating high-performance RF, analog and digital
    Best-in-class ESD and reliability
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    Ideal solutions for optimizing transmission phase angle
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    Digital control interface with parallel and serial programming options
    Best-in-class ESD and reliability
  • Monolithic Phase & Amplitude Controllers (MPACs)

    Reliable phase and amplitude control for next-generation communications
    Monolithic CMOS solution that integrates RF, analog and digital
    Integrated solution for Doherty power amplifier optimization (MPAC–Doherty)
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    Small form factor with high Q
    Monolithically integrated impedance tuning solution
    Wide-band tuning coverage, minimum mismatch losses, high linearity and fast switching speed
    Best-in-class ESD and reliability
  • Power Limiters

    Highly integrated solutions, smaller and more reliable than PIN-diode solutions
    Adjustable threshold control for maximum design flexibility
    High power handling and linearity required for wide-dynamic-range designs
    Fast response and recovery times for instantaneous protection and rapid return
  • Prescalers

    Exceptional performance with high-frequency support up to 13.5 GHz
    Low phase noise performance and low power consumption solutions
    Bare-die solutions for a wide variety of compact high-performance applications
    Best-in-class ESD and reliability
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    Broadband quad MOSFET array cores for high performance
    Industry-leading linearity, isolation and low conversion loss
    Available in MSOP, DFN and QFN packages
    Best-in-class ESD and reliability
  • Switch LNA

    Integrates dual-channel LNA with bypass function & high-power switch
    20W average RF input power
    Low noise figure of 0.9 dB
    +105°C operating temperature

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