PE42612 UltraCMOS™ SP4T Switch adds direct 1.8V control
San Diego, California, November 14, 2006 — Peregrine Semiconductor, a supplier of the industry’s most advanced RF CMOS integrated circuits, today announced the availability of the PE42612 RF antenna switch – a Flip-Chip SP4T Switch for multi-band GSM/EDGE handset applications. This new device features both 1.8V and 2.75V control logic, which enables the Antenna Switch Module (ASM) to be connected directly to any RF transceiver technology, eliminating the need for a voltage converter. All new Peregrine antenna switches incorporate this feature, enabling complete design flexibility. Like its predecessor, the PE4261, the PE42612 offers the lowest total height and smallest footprint solution by implementing flip-chip packaging. The use of advanced packaging technology reduces the PCB area and overall cost when compared to conventional wire bonding.
The 50-Ohm PE42612 complements the existing RF switch portfolio by incorporating unique UltraCMOS features: two-pin low-voltage CMOS logic control inputs; low TX insertion loss of 0.55 dB at 900 MHz and 0.70 dB at 1.9 GHz; high Isolation of 39 dB at 900 MHz and 31 dB at 1.9 GHz; low harmonics (2fo = -82 dBc and 3fo = -74 dBc at 35 dBm input power); 1500 V HBM ESD tolerance; an integrated CMOS decoder/driver and RX SAW over-voltage protection circuit. The device offers linear operation from 100 – 3000 MHz at 2.6 V with fast switch settling time. Further, the blocking capacitors typically found on pHEMT switches with positive control logic are not required for any UltraCMOS-based device.
Like all UltraCMOS antenna switches from Peregrine, this high-power device advances the industry, enabling new roadmaps to be drawn for next generation ASM designs where CMOS is directly connected to the antenna of a mobile handset. UltraCMOS-based products provide superior performance, lower insertion loss and higher integration alternatives to pin-diodes or pHEMT switch/CMOS designs.
The PE42612 is slated for high-volume production in multiple facilities, including those of Peregrine’s strategic partner, OKI Electric Industry Co., Ltd. (Tokyo, Japan). The device is priced at $0.52 ea. (10K units), and is available from Peregrine by contacting sales@psemi.bonfirela.com.
About UltraCMOS™ Technology
UltraCMOS™ mixed-signal process technology is a patented variation of silicon-on-insulator (SOI) technology on a sapphire substrate providing with high yields and competitive costs. This technology delivers significant performance advantages over competing processes such as GaAs, SiGe BiCMOS and bulk silicon CMOS in applications where RF performance, low power and integration are paramount.
About Peregrine Semiconductor
Peregrine Semiconductor Corporation designs, manufactures, and markets high-performance communications ICs for the wireless infrastructure and mobile wireless; broadband communications; space, defense and avionics markets. Manufactured on the Company’s proprietary UltraCMOS™ mixed- signal process technology, Peregrine products are uniquely poised to meet the needs of a global RF design community in high-growth applications such as WCDMA and GSM digital cellular, broadband, DTV, DVR and rad-hard space and defense programs. Peregrine 0.25µm and 0.5µm UltraCMOS devices are manufactured in its 6” CMOS facility located in Sydney, Australia and in Tokyo, Japan through an alliance with OKI Electric Industry Co., Ltd. The Company, headquartered in San Diego, California, maintains global sales support operations and a worldwide technical distribution network. Additional information is available on the web at psemi.bonfirela.com. Contact Peregrine’s worldwide distribution partner, Richardson Electronics (NASDAQ: RELL), for sales information at 1-800-737-6937.
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