PE4261 UltraCMOS™ Switch integrates control logic decoder and driver
San Diego, California, October 4, 2004 — Peregrine Semiconductor Corporation, a leading supplier of high-performance RF CMOS and mixed-signal communications ICs, today announced the availability of the PE4261 RF antenna switch – the world’s first Flip-Chip SP4T Switch for dual-band GSM handset applications. This new landmark device provides Antenna Switch Module (ASM) manufacturers the lowest total height and smallest footprint solution by implementing flip-chip packaging. The use of advanced packaging technology reduces the PCB area by a factor of nine when compared to conventional wire bonding.
The 50-Ohm PE4261 complements the PE4263 RF switch also announced today with many unprecedented features, including: two-pin CMOS logic control inputs; low TX insertion loss of 0.55 dB at 900 MHz and 0.65 dB at 1.9 GHz; high Isolation of 45 dB at 900 MHz and 40 dB at 1.9 GHz; low harmonics (2fo = -85 dBc and 3fo = -72 dBc at 35 dBm input power); 1500 V HBM ESD tolerance at all ports; an integrated CMOS decoder/driver and RX SAW over voltage protection circuit. The device offers linear operation from 100 – 3000 MHz at 2.6 V with fast switch settling time. Further, the blocking capacitors typically found on pHEMT switches with positive control logic are not required for any UltraCMOS-based device.
Like the PE4263, this high-power device, developed on Peregrine’s UltraCMOS™ technology, advances the industry past traditional milestones and enables new roadmaps to be drawn for next generation ASM designs. For the first time ever, CMOS has been directly connected to the antenna of a GSM handset. UltraCMOS-based products provide superior performance, lower insertion loss and higher integration alternatives to pin-diodes or pHEMT switch/CMOS designs.
The PE4261 is slated for high-volume production in multiple facilities, including those of Peregrine’s strategic partner, OKI Electric Industry Co., Ltd. (Tokyo, Japan). The device is priced at $0.52 ea. (10K units), and is available from Peregrine and its global distribution partner, Richardson Electronics.
Peregrine is known for its high-performance RF CMOS IC products which are ideally suited for a wide range of market segments, including Wireless Infrastructure and Mobile Wireless; Global Positioning (GPS); Optical; Broadband and Military/Space applications. The Company’s innovative CMOS process – UltraCMOS™ — combines the RF, mixed-signal, and digital capabilities of any other CMOS process, yet tolerates incredibly high voltages required for high-performance wireless applications.
About UltraCMOS™ Technology
UltraCMOS™ mixed signal process technology is a proprietary, patented variation of silicon-on- insulator (SOI) technology. It is the first commercially qualified use of Ultra-Thin-Silicon (UTSi®) on sapphire substrates with high yields and competitive costs. Significant performance advantages exist over competing processes such as GaAs, SiGe, BiCMOS and bulk silicon CMOS in applications where RF performance, low power and integration are paramount.
About Peregrine Semiconductor
Peregrine Semiconductor Corporation designs, manufactures, and markets high-performance communications ICs for the wireless, broadband cable communications, satellite and defense markets. The Company, which recently moved its headquarters to a larger San Diego, California facility, maintains established design centers and operations in Chicago, IL; Aix-en-Provence, France; Sydney, Australia; and Tokyo, Japan. Additional information is available on the web at psemi.bonfirela.com. Contact Peregrine’s worldwide distribution partner, Richardson Electronics (NASDAQ: RELL), for sales information at 1-800-737-6937.
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The Peregrine Semiconductor name, logo and UTSi are registered trademarks and Ultra CMOS is a trademark of Peregrine Semiconductor Corporation. All other trademarks are the property of their respective owners.